In the manufacturing of printed circuit boards (PCB), Oxone monopersulfate compound is a free-flowing powder chemical microetchant used for copper cleaning and surface preparation. Oxone [a solution of Lanxess] contains acidic potassium monopersulfate (KMPS) as it’s active component.

It is a distinct choice over non-in-kind competitors like hydrogen peroxide and sodium persulfate (SPS) as both of which can form free radical intermediates in the presence of dissolved copper ion. These free radical reactions have much more inconsistent reaction rates causing less predictable etch rates over time of the bath being used.

Due to the unique chemical structure of Oxone, copper is oxidised more effectively & efficiently. It’s uniform distribution of well-defined grain structure produces better etched copper surface morphology thus improving adhesion for metal plating, dry film, final finishes and IC packaging.

Oxone chemistry offers the consistent and predictable etch rates necessary to enhance process control values, a pre-requisite for multi-step processing of thin foils, HDI, and SAP processes, thus increases overall positive yield.

Do get in touch with Duro Kimia for further technical details and guidance of use on Oxone.